Integration Example

INTEGRATED PRODUCT EXAMPLE - THREE-CHANNEL SWITCH FILTER

Design Description. A three-channel switch filter assembly was realized using the modular-microstrip design approach. This assembly was broken down into the following components (as illustrated in the assembly's block diagram):

3 bandpass filters (6 GHz, 12 GHz, and 16 GHz).
1 broadband (2 – 18 GHz) SP3T switch.
1 broadband (2 – 18 GHz) SP2T switch (with additional thru-path).
Switch driver.

SWF Components Modules. As apparent from the adjacent photograph, the microstrip design approach requires minimal space and offers significant design flexibility.

The microstrip bandpass filters are constructed using lumped element technology in a kovar package. The microstrip transitions are prepared with an Sn63 solder pad.
The PIN-diode switches are constructed in kovar packages with microstrip transitions prepared with an Sn63 solder pad. DC power is routed from PIN diodes to solder pads provided on the reverse.
The PIN-diode switch driver is a hermetically sealed hybrid circuit packaged in a gold-plated kovar package.

SWF Finsihed Product Integration. The components were integrated and solder-sealed in this aluminum housing using soldered-in glass-to-metal feedthrus and cover. RF input / output was provided using SMA connectors.