Packaging

Solder Reflow Notes / RF Connectors / Surface Mount Products

Standard Packaging, Extraordinary Delivery.

CUSTOM PACKAGING

Q Microwave will provide all of its products in custom packaging as required by your configuration and manufacturing techniques. Our experience is summarized in the below table.

INPUT / OUTPUT STYLE

MATERIAL

SEALING METHOD

ATTACHMENT METHOD

Pins - Straight

Aluminum

Brass

Polyamide

Kovar

Stainless Steel

Solder

Epoxy

Seam Weld

Laser Weld

Hand Soldered

Reflow Soldered

Wave Soldered

Epoxy Attached

Mechanical Fasteners

STANDARD PACKAGING

While Q Microwave will provide filters meeting custom packaging requirements, use of standard packaging will provide extraordinary reductions in delivery lead-time.

Q Microwave's standard product packaging provide use of either Surface Mount Technology (SMT), microstrip launches, SMA connectors, or pins (straight or formed). Follow this link for a summary of Q Microwave´s surface mount packaging capabilities. Standard housing materials, exterior finishes, and sample outline sketches are provided in the below table. Specific outline drawings will be provided based upon specific filter requirements. Contact us for details.

INPUT / OUTPUT	HOUSING MATERIAL	EXTERIOR FINISH	SAMPLE OUTLINE
Microstrip Launches	Kovar	Silver plating
Pins (Straight or Formed)	Brass	Bare brass
SMA Connectors	Brass	Bare brass
Surface Mount Technology	Polyamide substrate and Kovar cover	Silver plating

High Temperature Capability. High-temperature designs are available that withstand 210ºC for 15 seconds or 235ºC for 2 minutes. See our solder reflow notes.
Hermeticity - Hermetic designs (to MIL-STD-202 gross leak test procedures) are available.
Paint - If paint is required as an exterior finish, polyurethane paint (Commercial equivalent to MIL-C-85285) is available.
Marking - Per MIL-STD-130.