Solder Reflow Notes / RF Connectors / Surface Mount Products
Installation Notes for SN96-Solder Assemblies
These notes are provided as guidelines and recommendations for the installation of Q Microwave components constructed with Sn96 solder.
Attachment Processes - Attachment must be achieved with a process that provides reliable electrical contact from the device and leads (if applicable) to the substrate or board. The filter's internal temperature must not be permitted to exceed 220C:
Soldering Iron – When applying solder with a soldering iron, insure that the assembly's temperature does not exceed 220C. Temperature can be minimized by reducing the soldering iron temperature, minimizing the time the iron is applied, and through use of heat sinks applied at other points on the assembly at the time of soldering. Typically, leads can be soldered using a soldering iron without causing damage to the assembly if the iron is applied continuously for no greater than 30 seconds.
Solder Reflow Process – Use of solder reflow processes can be utilized following the reflow profile of Figure 1. It is critical that the filter's internal temperature not be permitted to exceed 220C. This profile provides adequate margin to this critical temperature while permitting reflow attachment of the device with Sn63 solder (or variants).
- Package Installation - Recommended processes include epoxy attachment with conductive epoxy, solder attachment with soldering iron, or solder attachment with a solder reflow process.
- Lead Installation (if applicable) - Recommended processes include solder attachment with soldering iron, solder attachment with a solder reflow process, or gap welding.
Figure 1: Solder Reflow Profile
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